Laser additive production (LAM) e kopantsoeng le taolo ea linomoro tsa khomphutha (CNC) e emela mokhoa o fetohang tlhahisong ea sejoale-joale, e nolofalletsang tlhahiso ea likarolo tse rarahaneng tse nang le thepa e hlophisitsoeng. Ts'ebetso ena e nyalisitsoeng ea tlhahiso e kopanya ho beoa ha thepa ea LAM ka mokhoa o nepahetseng ka mokhoa o nepahetseng oa ho tlosa CNC, e lumellang hore ho thehoe likarolo tse nang le li-geometri tse rarahaneng, thepa e ntlafalitsoeng ea mochini, le liphetho tse ntlafalitsoeng tsa bokaholimo. Leha ho le joalo, khokahano lipakeng tsa lisebelisoa tse kentsoeng ke LAM le libaka tse nchafalitsoeng tsa CNC li hlahisa liphephetso tse kholo tse amanang le tsoelo-pele ea microstructure le phetoho ea khatello ea mocheso. Liketsahalo tsena li etsahala ka har'a sekala sa nako tse ngata, ho tloha ho lipotoloho tse potlakileng tsa mocheso nakong ea ts'ebetso ea laser ho ea ho tšebelisano e liehang ea mochini le mocheso nakong eo. CNC lisebelisoa. Ho utloisisa tšebelisano lipakeng tsa tsoelo-pele ea microstructure le khatello ea mocheso ho bohlokoa bakeng sa ho ntlafatsa ts'ebetso, ho ts'epahala, le ho tšoarella ha likarolo tse kopaneng tse hlahisoang ka mokhoa ona oa lebasetere.

Sengoliloeng sena se hlahloba tsoelo-pele ea microstructure ho sebopeho sa LAM-CNC e tsosolositsoeng likarolo tsa motsoako le ho iphetola ha khatello ea mocheso ho pholletsa le litekanyo tse ngata tsa nako. E kenella ka har'a melao-motheo ea lits'ebetso tsa LAM le CNC, liphetoho tsa metallurgic ho sebopeho, le mekhoa e laolang nts'etsopele ea khatello ea mocheso. Liphuputso tsa morao-rao li hlahlojoa ho fana ka kutloisiso e feletseng ea liketsahalo tsena, tse tšehetsoeng ke litafole tse qaqileng tse bapisang mekhahlelo ea bohlokoa le liphello. Sengoloa se hlophisitsoe ho fana ka tlhahlobo e matla, ea mahlale ea sehlooho, e loketseng bafuputsi, baenjiniere le barutehi mafapheng a mahlale a thepa, boenjiniere ba mechini, le tlhahiso ea tlatsetso.

Lintho tsa motheo tsa Laser Additive Manufacturing le CNC Reprocessing

Laser Additive Manufacturing

Ho etsa lisebelisuoa tsa laser ho kenyelletsa mekhoa e kang laser powder bed fusion (LPBF) le laser metal deposition (LMD), e sebelisang laser e matla haholo ho qhibilihisa le ho kopanya phofo e entsoeng ka tšepe kapa e kopantsoeng ka sekhahla. Ka mohlala, LPBF e kenyelletsa ho hasa lesela le lesesaane la phofo holim'a sethala sa mohaho, ho khetha ho qhibiliha ka laser, le ho le tiisa ho etsa mohaho o tiileng. LMD, ka lehlakoreng le leng, e fepa phofo kapa terata ka ho kopanya ka har'a sefate sa laser ho beha thepa holim'a substrate. Mekhoa ena e nolofalletsa ho etsoa ha li-geometri tse rarahaneng ka mokhoa o nepahetseng haholo, ho etsa hore li tšoanelehe bakeng sa lisebelisoa tsa sefofane, biomedical le likoloi. Leha ho le joalo, lipotoloho tse potlakileng tsa ho futhumatsa le ho pholile ho LAM li fella ka li-microstructures tse sa tšoaneng, likhatello tse phahameng tsa masala, le mefokolo e ka 'nang ea e-ba teng e kang porosity le mapetsong.

The microstructure ea likarolo tsa LAM e susumetsoa ke mekhoa ea ts'ebetso e kang matla a laser, lebelo la ho hlahloba, le ho arohana ha hatch. Ka mohlala, matla a phahameng a laser le lebelo le tlaase la ho hlahloba li fokotsa litekanyetso tsa ho pholisa, tse lebisang ho li-microstructures tse mahoashe, ha matla a tlaase le lebelo le phahameng li hlahisa lijo-thollo tse ntle ka lebaka la ho tiea ka potlako. The microstructure e hlahisoang hangata e bonts'a lits'oants'o tse phahameng tsa dislocation, meaho ea cellular, le kholo ea lijo-thollo ea anisotropic, e ka amang thepa ea mochini le ho hanyetsa kutu.

CNC Reprocessing

CNC reprocessing e kenyelletsa mekhoa ea machining ea subtractive, joalo ka ho sila, ho reteleha, kapa ho sila, ho ntlafatsa geometry, pheletso ea bokaholimo, le ho nepahala ha likarolo tsa LAM. Machining a CNC a tlosa thepa ho tsoa karolong e hahiloeng ea LAM, e sebetsana le litaba tse kang bohloeki ba bokaholimo le mamello e nyane eo hangata e leng ea bohlokoa molemong oa tlhahiso ea tlatsetso. Tšebelisano ea mechine pakeng tsa sesebelisoa sa ho itšeha le thepa ea LAM e baka khatello ea maikutlo sebakeng sa heno le liphetoho tse ka 'nang tsa e-ba teng tsa microstructural, haholo-holo ho sehokelo pakeng tsa thepa e behiloeng ke LAM le holim'a mochini.

Ho kopanngoa ha CNC reprocessing le LAM ho theha ts'ebetso ea tlhahiso ea lebasetere e matlafatsang matla a mekhoa ea ho eketsa le ho fokotsa. Leha ho le joalo, sebaka sa phetoho pakeng tsa thepa e kentsoeng ea LAM le sebaka se entsoeng ka mochine oa CNC se hlahisa mathata a ho tsoela pele ha microstructure le kabo ea khatello ea kelello, e leng ntho ea bohlokoa mosebetsing oa karolo.

Mokhoa oa Hybrid LAM-CNC

Ts'ebetso e nyalisitsoeng ea LAM-CNC e kenyelletsa ho kenya thepa ka LAM, e lateloe ke machining ea CNC ho fihlela geometry e lakatsehang le boleng ba bokaholimo. Mokhoa ona o molemo ka ho khetheha bakeng sa likarolo tse kopantsoeng, moo li-reinforcements tse kang likaroloana tsa ceramic kapa likhoele li kenngoa ka har'a matrix ea tšepe ho matlafatsa thepa e kang matla, ho thatafala le ho hanyetsa ho apara. Khokahano pakeng tsa motsoako oa LAM-deposited le sebaka se entsoeng ka mochine oa CNC ke sebaka sa bohlokoa moo ho tsoela pele ha microstructure le ho iphetola ha khatello ea mocheso ho tlameha ho laoloa ka hloko ho thibela mefokolo le ho netefatsa ts'ebetso e nepahetseng.

Tsoelo-pele ea Microstructure ho LAM-CNC Interface

Litšobotsi tsa Microstructural tsa Likarolo tsa LAM

Mekhoa ea LAM e hlahisa likarolo tse ikhethang tsa microstructural ka lebaka la litekanyetso tsa bona tsa ho tiisa ka potlako le histori e rarahaneng ea mocheso. Likarolo tsena li kenyelletsa:

• Phaello e Phahameng ea Ts'ebetso: Ho pholile ka potlako ho LAM ho etsa hore ho be le sekhahla se phahameng sa ho senyeha, se tlatsetsang matla a thepa empa hape se ka lebisa khatellong ea masala.

• Mehaho ea Mehala le Dendritic: The melt pool dynamics in LAM bopa li-cellular kapa dendritic substructures, ka boholo ba lisele ho tloha ho sub-micron ho ea ho microns tse 'maloa, ho itšetlehile ka sekhahla sa ho pholisa le motsoako oa alloy.

• Khōlo ea Lithollo tsa Anisotropic: Phallo ea mocheso e lebisang ho LAM e lebisa ho kholo ea lijo-thollo tsa kholomo haufi le tataiso ea mohaho, e hlahisang thepa ea mechine ea anisotropic.

• Liphetoho tsa Mokhahlelo: Ka li-alloys tse kang Ti-6Al-4V, ho pholisa ka potlako ho ka lebisa ho thehoeng ha mekhahlelo ea martensitic, e kang α′-martensite, e amang thepa ea mechine le ea ho senya.

Litšobotsi tsena tsa microstructural li susumetsoa ke mekhahlelo ea ts'ebetso le sebopeho sa thepa. Ka mohlala, ho LPBF ea 316L tšepe e sa hloekang, leano le tsoelang pele la ho hlahloba le hlahisa lijo-thollo tse nyane le boholo ba lisele (400-900 nm lisele tse ka hare ho 40-60 μm thollo) ha li bapisoa le maqheka a mela, ho matlafatsa thepa ea mechine.

Liphetoho tsa Microstructural Nakong ea CNC Reprocessing

CNC machining e hlahisa deformation ea mochini le ho futhumatsa sebakeng se ka holim'a likarolo tsa LAM, ho fetola microstructure sebakeng sa mochine. Liphetoho tsa bohlokoa li kenyelletsa:

• Bokaholimo bo Recrystallization: Matla a mochini a tsoang ho seha a ka etsa hore ho be le recrystallization sebakeng se haufi-ufi, ho fetola lithollo tse hahiloeng joalo ka lithollo hore e be lijo-thollo tse ntle, tse lekanang.

• Phetoho ea polasetiki: Ts'ebetso ea ho itšeha e hlahisa khatello ea polasetiki, e lebisang ho hoketseheng ha letsoalo la dislocation le ho thatafala ho ka bang teng mosebetsing oa lera le entsoeng ka mochini.

• Liphello Tsa Mocheso: Khohlano pakeng tsa sesebelisoa sa ho itšeha le workpiece e hlahisa mocheso oa sebakeng seo, o ka bakang liphetoho tsa mekhahlelo kapa li-annealing sebakeng se haufi-ufi, ho itšetlehile ka mocheso o fihletsoeng.

Liphetoho tsena li theha sebaka se ikhethileng sa phetoho ea microstructural ho sebopeho sa LAM-CNC, moo sebopeho sa LAM se hahelletsoeng se kopanang le sebaka se fetotsoeng sa CNC. Ho netefatsa ho tsoelapele ho pholletsa le segokahanyi sena ke habohlokoa ho boloka botšepehi ba karolo ea mochine.

Mekhoa ea ho Tsoela Pele ha Microstructure

Microstructure continuity e bua ka kopanyo e se nang moeli ea likarolo tsa microstructural ho pholletsa le sebopeho sa LAM-CNC, ho fokotsa likoli tse kang mapetsong, delamination, kapa liphetoho tsa tšohanyetso tsa morphology ea lijo-thollo. Mekhoa e mengata e laola tsoelo-pele ena:

• Kopanyo ea Meeli ea lijo-thollo: Ho lumellana ha meeli ea lijo-thollo pakeng tsa thepa e behiloeng ka LAM le sebaka se entsoeng ka mochine oa CNC ho ama matla a sebopeho. Meeli e sa lumellaneng e ka lebisa khatellong ea maikutlo le ho qala ho phatloha.

• Phapano ea Phase: Likarolong tse kopantsoeng, ho lumellana pakeng tsa matrix le mekhahlelo ea ho matlafatsa (mohlala, likaroloana tsa TiC ka matrix a titanium) ke habohlokoa. Mechine ea CNC e ka sitisa ho ajoa ha li-reinforcements, e leng se lebisang ho khethollo ea mekhahlelo kapa ho arohana ha sefahleho.

• Thermal History Matching: Histori ea mocheso nakong ea mekhoa ea LAM le CNC e tlameha ho laoloa ho fokotsa phapang pakeng tsa ho iphetola ha lintho tsa microstructure. Ka mohlala, ho futhumatsa substrate nakong ea LAM ho ka fokotsa li-gradients tsa mocheso, ho khothalletsa kholo ea lijo-thollo tse tšoanang.

Liphuputso tsa morao-rao li bonts'itse hore ho ntlafatsa liparamente tsa CNC, joalo ka lebelo la ho itšeha le sekhahla sa phepelo, ho ka fokotsa tšitiso ea sebopeho sa microstructural. Mohlala, lebelo le tlase la ho itšeha le fokotsa mocheso o sa tsitsang, ho boloka microstructure e hahiloeng joalo ka ha lebelo le phahameng le ka baka recrystallization kapa liphetoho tsa mekhahlelo.

Mathata a ho Boloka Tsoelo-pele ea Microstructure

Ho boloka tsoelo-pele ea microstructure ho LAM-CNC interface ho thata ka lebaka la:

• Thermal Mismatch: Lipotoloho tse potlakileng tsa mocheso ho LAM li fapana le ho futhumatsa sebakeng sa CNC, ho lebisang ho se tšoane ka boholo ba lijo-thollo le sebopeho sa mohato ho pholletsa le sebopeho.

• Khatello ea Mechini: CNC machining e hlahisa likhatello tsa ho kuta tse ka bakang li-microcracks kapa delamination, haholo-holo ka li-composite tse nang le li-brittle reinforcements.

• Reinforcement Redistribution: Ka li-composites tsa tšepe tsa matrix (MMCs), machining a CNC a ka arola likaroloana tsa ceramic hape, a theha likabelo tse matlafatsang tse sa ts'oaneng tse fokolisang sebopeho.

Ho rarolla mathata ana, bafuputsi ba hlahlobile maano a kang laser-assisted CNC machining, moo laser e futhumatsang mochini oa ho sebetsa ho fokotsa matla a ho itšeha le li-gradients tsa mocheso, le kalafo ea mocheso ka mor'a ho sebetsa ho etsa homogenize microstructure.

Phetoho ea Khatello ea Mocheso ho pholletsa le Mekhahlelo e mengata ea Nako

Khatello ea Mocheso Mekhoeng ea LAM

Khatello ea mocheso ho LAM e hlaha ho tloha mocheso o potlakileng oa ho futhumatsa le ho pholile o amanang le ts'ebetso. Likhatello tsena li fetoha ka linako tse ngata:

• Sekala sa Nako e Khutšoane (Li-Microseconds ho isa ho Milliseconds): Nakong ea ho hlahloba ka laser, letamo la ho qhibiliha le futhumala ka potlako (ho fihla ho 10^6 K/s) le ho tsidifala (10^4–10^6 K/s), e leng se lebisang ho thecheso e phahameng ea mocheso le khatello e phahameng ea mocheso. Likhatello tsena li bakoa haholo-holo ke katoloso ea mocheso le ho sekama ha tšubuhlellano lipakeng tsa libaka tse qhibilihileng le tse tiileng.

• Likhakanyo tsa Nako tse Hare (Metsotsoana ho isa ho Metsotso): Ha likarolo tse ngata li kenngoa, ho tsosolosoa ha cyclic le ho qhibiliha ho etsahala, ho bokella likhatello tse setseng ho pholletsa le karolo. Likhatello tsena li susumetsoa ke leano la ho hlahloba le lisebelisoa tsa laser, ka ho hlahloba khafetsa ho hlahisa khatello e tlase ho feta maano a lihlekehleke ka lebaka la kabo e tšoanang ea mocheso.

• Tekanyo ea nako e telele (lihora ho isa ho matsatsi): Liphekolo tsa ka morao ho ts'ebetso, joalo ka annealing kapa hot isostatic pressing (HIP), li ka imolla khatello ea kelello e setseng empa li ka fetola sebopeho sa microstructure, tse ka fokotsang thepa ea mochine.

Boholo le kabo ea likhatello tsa mocheso li itšetlehile ka thepa ea thepa, e kang coefficient of thermal expansion (CTE), le mekhahlelo ea ts'ebetso. Mohlala, lisebelisoa tse nang le CTE e tlase, joalo ka Invar, li bonts'a likhatello tsa mocheso ho LAM.

Khatello ea Mocheso Nakong ea ho Reprocessing ea CNC

Mechini ea CNC e hlahisa khatello e eketsehileng ea mocheso ka lebaka la ho futhumala ha mocheso le ho senyeha ha mochini. Likhatello tsena li fetisetsoa sebakeng se entsoeng ka mochini mme li fetoha ka nako e fapaneng:

• Sekala sa Nako e Khutšoane (Milliseconds ho isa Metsotsoaneng): Ho futhumala ha frictional nakong ea ho itšeha ho hlahisa li-spikes tsa mocheso sebakeng sa heno, tse ka bakang khatello ea mocheso sebakeng se haufi. Likhatello tsena hangata li hatella ka lebaka la tšitiso ea mochini oa sesebelisoa sa ho itšeha.

• Likhakanyo tsa Nako tse Hare (Metsotso): Ha machining a ntse a tsoela pele, mocheso o bokellana mosebetsing, o ka bakang ho atolosoa ha mocheso le ho phomola ha khatello ea kelello linthong tse behiloeng ke LAM.

• Sekala sa nako e telele (lihora): Ho pholisa ka mor'a mochini ho ka lebisa ho kabong e setseng ea khatello ea maikutlo, haholo-holo haeba karolo e sa tsitsa ka mocheso.

Tšebelisano lipakeng tsa likhatello tsa masala tse bakoang ke LAM le likhatello tse bakoang ke CNC li ka mpefatsa bofokoli joalo ka ho soahlamana kapa ho petsoha, haholo-holo ka metsoako e nang le li-CTE tse sa lumellaneng lipakeng tsa matrix le li-reinforcements.

Mehlala e Mengata ea Khatello ea Mocheso

Ho etsa mohlala oa phetoho ea khatello ea mocheso likarolong tsa LAM-CNC ho hloka mekhoa e mengata ea ho tšoara tšebelisano e rarahaneng ea liketsahalo tsa mocheso le mechine. Mekhoa ea bohlokoa e kenyelletsa:

• Finite Element Method (FEM): FEM e sebelisetsoa ho etsisa ho fetisa mocheso, ho qhibiliha matla a letamo, le tsoelo-pele e setseng ea khatello ea kelello nakong ea LAM. E ikarabella bakeng sa thepa ea thepa e itšetlehileng ka mocheso le liphetoho tsa mekhahlelo.

• Cellular Automata (CA): Mefuta ea CA e etsisa kholo ea lijo-thollo le kholo ea microstructure, e fana ka leseli mabapi le litlamorao tsa li-gradients tsa mocheso meahong e tiileng.

• Mokhoa oa Tšimo ea Phase (PF).: Mekhoa ea PF ea mekhoa ea phetoho ea mekhahlelo le ho thehoa ha dendrite, ho nka liphetoho tsa microstructural ho nano- le micro-scales.

• Computational Fluid Dynamics (CFD): CFD e etsisa ho phalla ha metsi a letamo le ho fetisa mocheso, ho bolela esale pele phello ea li-parameter tsa laser khatellong ea mocheso.

Mefuta ena e kopantsoe ho bolela esale pele ho fetoha ha khatello ea mocheso ka nako e telele. Ka mohlala, mohlala o kopantsoeng oa CA-FEM o sebelisitsoe ho etsisa phetoho ea microstructure le nts'etsopele ea khatello ea kelello ho LPBF ea Ti-6Al-4V, e senola phello ea matla a laser le lebelo la ho hlahloba ho morphology ea lijo-thollo le khatello ea kelello e setseng.

Mekhoa ea ho Fokotsa Bakeng sa Khatello ea Mocheso

Ho fokotsa khatello ea mocheso likarolong tsa LAM-CNC ho kenyelletsa ho ntlafatsa mekhoa ea ts'ebetso le mekhoa ea morao-rao ea ts'ebetso:

• Ho futhumatsa: Ho futhumatsa substrate nakong ea LAM ho fokotsa likhahla tsa mocheso, ho fokotsa khatello ea masala. Ka mohlala, ho futhumatsa Ti-6Al-4V ho 400 ° C ho ka fokotsa khatello ea kelello e setseng ka 50%.

• Ntlafatso ea Leano la Scan: Mekhoa e tsoelang pele ea ho hlahloba e fokotsa likhahla tsa mocheso ha e bapisoa le mekhoa ea lihlekehleke kapa ea mela, e fokotsa khatello ea maikutlo.

• Liphekolo tsa Mocheso ka mor'a ho sebetsa: Mekhoa e kang HIP le ho kokobetsa ho imolla khatello ea kelello e setseng, empa e ka 'na ea hohola microstructure, ea ama thepa ea mochini.

• CNC e Thusang ka Laser: Ho futhumatsa mochini oa mosebetsi ka laser nakong ea machining ea CNC ho fokotsa matla a ho itšeha le khatello ea mocheso, ho ntlafatsa boleng ba bokaholimo.

Lithuto tsa Morao-rao le Tsoelo-pele

Lithuto tsa Tsoelo-pele ea Microstructure

Lithuto tsa morao-rao li ntlafalitse kutloisiso ea tsoelo-pele ea microstructure likarolong tsa LAM-CNC:

• Wang et al. (2020) e ile ea etsa lipatlisiso ka phetoho ea microstructural ea CrMnFeCoNi high-entropy alloy tlas'a cyclic quick loading ea mocheso ho selective laser melting (SLM). Ba fumane hore meroalo ea mocheso oa cyclic e baka marang-rang a ho kheloha a matlafatsang matla empa a ka sitisa ho tsoela pele ho li-interfaces tsa mochini.

• Liu et al. (2018) e ithutile ka WC e matlafalitsoeng ka li-composite tsa Fe-based tse entsoeng ke LAM, ho hlokomela hore li-interface tsa gradient reinforcement/matrix li ntlafatsa tsoelo-pele ea microstructure ka ho fokotsa khatello ea mocheso e sa lumellaneng.

• Salman le ba bang. (2019) e ile ea hlahloba ho kenyelletsoa ha TiB2 ho 316L tšepe e sa hloekang ho SLM, ho fumana hore TiB2 e khothalletsa mekhoa e metle ea lijo-thollo, e matlafatsang khokahanyo ea li-interface nakong ea ts'ebetso ea CNC.

Thermal Stress Evolution Studies

Tsoelo-pele ea mohlala oa khatello ea mocheso le phokotso e kenyelletsa:

• Chen le ba bang. (2021) e sebelisitse EBSD ho sekaseka litšepe tsa LAM, ho bonts'a hore kalafo ea kamora mocheso e ka etsa homogenize morpholoji ea lijo-thollo le ho fokotsa khatello ea maikutlo e setseng, ho ntlafatsa botsitso ba sebopeho.

• Zhao et al. (2020) e ile ea etsa lipatlisiso tsa laser metal deposition ea AA5024 e nang le nanoparticulate TiC, ea fumana hore li-parameter tsa laser tse ntlafalitsoeng li fokotsa khatello ea mocheso le ho ntlafatsa tsoelo-pele ea microstructure.

• Dong et al. (2020) e thehile mohlala oa FEM ho etsisa boits'oaro ba mocheso ho SLM ea AlSi10Mg, e hokahanyang li-microstructure heterogeneities le phetoho e setseng ea khatello ea maikutlo le ho fana ka maikutlo a maano a ho fokotsa khatello ea kelello.

Ho Ithuta ka Mechini le ho Ntlafatsa

Ho ithuta ka mochini (ML) ho hlahile e le sesebelisoa se matla sa ho ntlafatsa lits'ebetso tsa LAM-CNC:

• Tang le al. (2023) e sebelisitse ML ho hakanya microstructure ea ceramic nakong ea laser sintering, ho ntlafatsa liparamente ho fokotsa khatello ea mocheso le ho boloka microstructure tsoelapele.

• Ho latela al. (2023) e sebelisitse moralo o sebetsang oa Pareto oa ho ithuta ho ntlafatsa liparamente tsa LPBF bakeng sa Ti-6Al-4V, ho fumana matla a phahameng le ho sebetsa ka thata ka khatello e fokolang ea mocheso.

• Saemathong et al. (2023) bapisa mefuta ea lipalo tsa matla a mocheso bakeng sa LAM, ho sebelisa ML ho ntlafatsa mekhoa ea ts'ebetso le ho fokotsa likhatello tse setseng.

Tlhahlobo ea Papiso le Litafole tsa Boitsebiso

Ho fana ka papiso e pharaletseng ea tsoelo-pele ea microstructure le ho iphetola ha khatello ea mocheso, litafole tse latelang li akaretsa liphuputso tsa bohlokoa ho tsoa lithutong tsa morao-rao le mekhoa ea ts'ebetso.

Letlapa la 1: Litšobotsi tsa Microstructural tsa Lisebelisoa tsa LAM-CNC

Letlapa la 2: Phetoho ea Khatello ea Mocheso ho Feta Mekhahlelo ea Nako

Letlapa la 3: Ts'ebetso ea Paramethara ea Ts'ebetso bakeng sa Microstructure le Taolo ea Khatello ea Maikutlo

Litsela le Liphephetso tsa Kamoso

Ho kopanngoa ha LAM le CNC reprocessing ho fana ka monyetla o moholo oa ho hlahisa likarolo tse ngata tse sebetsang hantle, empa mathata a mangata a ntse a le teng:

• Multi-Scale Modeling: Ho theha mefuta e felletseng e hokahanyang liphetoho tsa nano-scale phase to macro-scale stress evolution ke ea bohlokoa bakeng sa ho bolela esale pele le ho laola boitšoaro ba sebopeho.

• Tlhahlobo ea Nako ea Sebele: Ho kenya ts'ebetsong lits'ebetso tsa ho lekola nako ea nnete, joalo ka tse sebelisang ho ithuta ka mochini, ho ka ntlafatsa maemo a ts'ebetso le ho netefatsa ts'ebetso ea microstructure.

• Maano a Khethehileng: Ho lokisa litsamaiso tsa ts'ebetso bakeng sa lisebelisoa tse khethehileng, haholo-holo lihlopha tse nang le mekhahlelo e matla ea ho matlafatsa, ho bohlokoa bakeng sa ho fokotsa liphoso.

• itsetsepetse: Ho fokotsa ts'ebeliso ea matla le litšila tsa lisebelisoa lits'ebetsong tse nyalisitsoeng tsa LAM-CNC ke taba e ntseng e hola, e hlokang lits'ebetso tse ncha molemong oa ts'ebetso le ho e sebelisa hape.

Lipatlisiso tsa nako e tlang li lokela ho tsepamisa maikutlo ho kopantseng lisebelisoa tse tsoetseng pele tsa khomphutha, joalo ka ho ithuta ka mochini le lipapiso tsa fisiks tse ngata, ka netefatso ea liteko ho fihlela taolo e nepahetseng holim'a microstructure le khatello ea maikutlo. Boiteko ba tšebelisano lipakeng tsa barutehi le indasteri bo tla ba bohlokoa bakeng sa ho fetolela tsoelopele ena hore e be lits'ebetso tse sebetsang.

fihlela qeto e

Tsoelo-pele ea microstructure ho segokanyimmediamentsi sa sebolokigolo sa LAM-CNC reprocessed composite likarolo le ho iphetola ha mogote khatello ea ka mose ho multiple time sekala ke lintlha tse mahlonoko tseo ho leng ho khethollang tshebetso ya lebasetere likarolo tse entsoeng. Tšebelisano e rarahaneng ea lipotoloho tse potlakileng tsa mocheso ho LAM le likhatello tsa mochini ho CNC machining li baka mathata a ikhethang ho boloka tsoelo-pele ea microstructure le ho laola khatello ea mocheso. Liphuputso tsa morao-rao li fane ka lintlha tsa bohlokoa mabapi le liketsahalo tsena, li totobatsa bohlokoa ba mekhoa e ntlafalitsoeng ea ts'ebetso, mekhoa ea phekolo ea morao-rao le mekhoa e tsoetseng pele ea ho etsa mohlala. Ka ho sebetsana le liphephetso tsena ka maano a macha le lipatlisiso tse fapaneng, ts'ebetso e nyalisitsoeng ea LAM-CNC e ka bula menyetla e mecha ea ho etsa likarolo tse nang le ts'ebetso e phahameng ea ts'ebetso e nang le lits'ebetso tsa sefofane, biomedical, le ho feta.

Polelo e Hatisitsoeng: Haeba ho se na litaelo tse ikhethang, lingoloa tsohle tse fumanehang sebakeng sena sa marang-rang ke tsa mantlha. Ka kopo bonts'a mohloli oa khatiso: https: //www.cncmachiningptj.com/ li -ththanks！

PTJ® e fana ka mefuta e felletseng ea Custom Precision cnc machining china ISO 9001: 2015 & JOALOKAHA-9100 pakiloeng. 3, 4 le 5-axis ka potlako e nepahetseng litšebeletso tsa machining tsa CNC ho kenyelletsa le ho sila, ho fetohela ho litlhaloso tsa bareki, Ho khona likarolo tsa tšepe le polasetiki tse nang le mamello ea +/- 0.005 mm.shoa ho lahla,lesela la tšepe 'me stampHo fana ka lipapatso, tlhahiso e felletseng, tšehetso ea tekheniki le tlhahlobo e felletseng likoloi, aerospace, hlobo le sesebelisoa, mabone a lebisitsoeng,ya kalafi, baesekele, le moreki elektronike liindasteri. Ho fana ka nako. Re bolelle hanyane ka tekanyetso ea projeke ea hau le nako e lebelletsoeng ea ho fihla. Re tla rera leano la ho fana ka lits'ebeletso tse baballang litšenyehelo ho u thusa ho fihlela sepheo sa hau, Rea u amohela ho Ikopanye le rona ( sales@pintejin.com ) ka kotloloho bakeng sa projeke ea hau e ncha.